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 SI3867DV
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W)
0.051 @ VGS = - 4.5 V - 20 0.067 @ VGS = - 3.3 V 0.100 @ VGS = - 2.5 V
FEATURES
ID (A)
- 5.1 - 4.5 - 3.7
D TrenchFETr Power MOSFET D PWM Optimized
APPLICATIONS
D DC/DC - HDD - Power Supplies D Portable Devices Such As Cell Phones, PDA, DSC, and DVC
(4) S
TSOP-6 Top View
1 3 mm 6 5
(3) G
2
3
4 (1, 2, 5, 6) D P-Channel MOSFET
2.85 mm Ordering Information: SI3867DV-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Diode Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 85_C TA = 25_C TA = 85_C
Symbol
VDS VGS ID IDM IS PD TJ, Tstg
5 secs
Steady State
- 20 "12
Unit
V
- 5.1 - 3.7 - 20 - 1.7 2.0 1.0 - 55 to 150
- 3.9 - 2.8 A
- 0.9 1.1 0.6 W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 72068 S-31988--Rev. B, 13-Oct-03 www.vishay.com t v 5 sec Steady State Steady State
Symbol
RthJA RthJF
Typical
45 90 25
Maximum
62.5 110 30
Unit
_C/W C/W
1
SI3867DV
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = - 250 mA VDS = 0 V, VGS = "12 V VDS = - 16 V, VGS = 0 V VDS = - 16 V, VGS = 0 V, TJ = 85_C VDS = - 5 V, VGS = - 4.5 V VGS = - 4.5 V, ID = - 5.1 A Drain-Source On-State Resistancea rDS(on) VGS = - 3.3 V, ID = - 4.5 A VGS = - 2.5 V, ID = - 2 A Forward Transconductancea Diode Forward Voltagea gfs VSD VDS = - 5 V, ID = - 5.1 A IS = - 1.7 A, VGS = 0 V - 20 0.041 0.054 0.081 11 - 0.7 - 1.2 0.051 0.067 0.100 S V W - 0.6 - 1.4 "100 -1 -5 V nA mA A
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = - 1.7 A, di/dt = 100 A/ms VDD = - 10 V, RL = 10 W ID ^ - 1 A, VGEN = - 4.5 V, RG = 6 W VDS = - 10 V, VGS = - 4.5 V, ID = - 5.1A 7 2.3 1.6 17 31 32 30 25 30 50 50 50 50 ns 11 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
20 VGS = 5 thru 3.5 V 3V I D - Drain Current (A) 20
Transfer Characteristics
TC = - 55_C 16 25_C
16 I D - Drain Current (A)
125_C
12 2.5 V
12
8
8
4
2V 1.5 V 0 1 2 3 4 5
4
0 VDS - Drain-to-Source Voltage (V) www.vishay.com
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS - Gate-to-Source Voltage (V) Document Number: 72068 S-31988--Rev. B, 13-Oct-03
2
SI3867DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.20 r DS(on) - On-Resistance ( W ) 1200 1000 C - Capacitance (pF) VGS = 2.5 V 0.12 800 600 400 Coss 200 0 0 4 8 12 16 20 0 4 8 12 16 20 Crss Ciss
Capacitance
0.16
0.08
VGS = 3.3 V VGS = 4.5 V
0.04
0.00
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 5.1 A 4 1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 5.1 A 1.4
3
r DS(on) - On-Resistance (W) (Normalized) 4 6 8
1.2
2
1.0
1
0.8
0 0 2 Qg - Total Gate Charge (nC)
0.6 - 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
20 TJ = 150_C 0.20
On-Resistance vs. Gate-to-Source Voltage
I S - Source Current (A)
10
r DS(on) - On-Resistance ( W )
0.16 ID = 2 A 0.12 ID = 5.1 A
0.08
0.04
TJ = 25_C 1 0.0 0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 72068 S-31988--Rev. B, 13-Oct-03
www.vishay.com
3
SI3867DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 0.3 V GS(th) Variance (V) ID = 250 mA 0.2 0.1 0.0 - 0.1 - 0.2 - 50 Power (W) 20 TA = 25_C 10 30
Single Pulse Power
25
5
- 25
0
25
50
75
100
125
150
0 0.01
0.1
1 Time (sec)
10
100
600
TJ - Temperature (_C)
100
Safe Operating Area
rDS(on) Limited IDM Limited
P(t) = 0.0001
10 I D - Drain Current (A) P(t) = 0.001 1 ID(on) Limited TA = 25_C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) P(t) = 0.01 P(t) = 0.1 0.1 P(t) = 1 P(t) = 10 dc
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (sec)
Notes: PDM t1
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA = 90_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
www.vishay.com
4
Document Number: 72068 S-31988--Rev. B, 13-Oct-03
SI3867DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (sec) 1 10
Document Number: 72068 S-31988--Rev. B, 13-Oct-03
www.vishay.com
5


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